featured products

  • PROLITH X3.1 – A virtual lithography tool that models line edge roughness and replicates underlying wafer topography, enabling researchers to cost-effectively investigate EUV and double patterning lithography technologies.
  • ICOS WI-2250 –Automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface defect inspection, and 2D bump inspection for the semiconductor IC, optoelectronics, advanced packaging, and MEMS markets.
  • 8900 - High speed patterned-wafer defect inspection system suitable for detecting a wide variety of defects in the sub-micron to five-micron range, for image-sensor development and production as well as other applications
  • Teron 600 - Reticle defect inspection platform with the sensitivity, flexibility and computational lithography power to enable development and manufacturing of reticles to support the wide variety of 2Xnm lithography schemes

 

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Results:

  • A faster path from data to decisions
  • Quicker response to changes in the market
  • Reliable, high performance products
  • Higher profitability and ROI
That`s the value of working with KLA-Tencor

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