featured products
- PROLITH X3.1 – A virtual lithography tool that models line edge roughness and replicates underlying wafer topography, enabling researchers to cost-effectively investigate EUV and double patterning lithography technologies.
- ICOS WI-2250 –Automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface defect inspection, and 2D bump inspection for the semiconductor IC, optoelectronics, advanced packaging, and MEMS markets.
- 8900 - High speed patterned-wafer defect inspection system suitable for detecting a wide variety of defects in the sub-micron to five-micron range, for image-sensor development and production as well as other applications
- Teron 600 - Reticle defect inspection platform with the sensitivity, flexibility and computational lithography power to enable development and manufacturing of reticles to support the wide variety of 2Xnm lithography schemes
Announcements
- KLA-Tencor Launches the PROLITH™ X3.1 Virtual Lithography Tool for Cost-Effective Investigation of EUV and Double Patterning Lithography Challenges (02/18/2010)
- KLA-Tencor Announces Live Webcast Of Investor Presentation At The 2010 Goldman Sachs Technology And Internet Conference (02/12/2010)
- KLA-Tencor Declares Regular Cash Dividend For Third Quarter Of Fiscal Year 2010 (02/04/2010)
We Partner with Our Customers
to develop solutions tailored to their objectivesResults:
- A faster path from data to decisions
- Quicker response to changes in the market
- Reliable, high performance products
- Higher profitability and ROI
In the News |